CHIPS-AWACKSM Data Repository Ecosystem (CADRE)

Welcome to the CHIPS-AWACKSM data discovery platform. Here, you can search and explore various datasets published by our team.

Files with data corresponding to the dropdown selection:
Datasets

  • A Dual Mode Brillouin/Low-Frequency Raman Spectroscopy Microscope for Local Mechanical Property Imaging for Semiconductor Packaging Materials

    Authors: Sebastian Engmann, Andrew J. Gayle, Stian K. Romberg, Christopher L. Soles, Chris A. Michaels

    First released: 2025-05-15 (revised 2026-04-27)

    https://doi.org/10.18434/mds2-3725 — Data Dictionary (CSV)

    Keywords: Brillouin light scattering spectroscopy, Low-frequency Raman spectroscopy, Microscopy, In situ, Kinetics.

  • Advanced Metrology Suite for Linking Residual Stress to Fundamental Properties of Thermoset Packaging Materials

    Authors: Polette Centellas, Stian Romberg, Gery Stafford, Karl F. Schock Jr., Huong Giang Nguyen, Ran Tao, Alexander K. Landauer

    First released: 2025-02-06

    https://doi.org/10.18434/mds2-3698 — Data Dictionary (CSV)

    Keywords: Encapsulant cure kinetics, Cure shrinkage, Residual stress, Digital image correlation.

  • Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant

    Authors: Ran Tao, Anthony P. Kotula, Jianwei Tu, Young Jong Lee

    First released: 2025-05-15

    https://doi.org/10.18434/mds2-3702 — Data Dictionary (CSV)

    Keywords: Microelectronics, Encapsulation, Optoelectronics, Cure kinetics, Rheology, Advanced packaging.

  • A Switchable Longitudinal & Shear BLS Microscope for Comprehensive Modulus Imaging of Semiconductor Packaging Materials

    Authors: Andrew J. Gayle, Sebastian Engmann, Ran Tao, Andrew G. Korovich, Polette Centellas, Yvonne B. Gerbig, Christopher L. Soles, Chris A. Michaels

    First released: 2026-05-21

    https://doi.org/10.18434/mds2-4059 — Data Dictionary (CSV)

    Keywords: Brillouin light scattering spectroscopy, Microscopy, Mechanical properties, Packaging, Polymers.

  • Controlling the Reaction Pathway to Tune Packaging Epoxy Properties

    Authors: Polette Centellas, Ran Tao, Huong Giang Nguyen, Jan Obrzut, Andrew Korovich, Alexander Landauer

    First released: 2026-05-21

    https://doi.org/10.18434/mds2-4101 — Data Dictionary (CSV)

    Keywords: Epoxy, Thermoset, Thermal curing, Moisture properties, Coefficient of thermal expansion, Residual stress.